Available Technology

M/L Constructions
  1. Buried & Blind Vias
  2. Sequential Lamination
  3. 1/4 oz. to 14 oz. Cu
  4. 0.005'' Buried/Blind Vias
  5. 0.008'' Through Board Vias
  6. Max. 42 Layers / 0.300'' Thickness
  7. Min. 4 Layers / 0.016'' Thickness
  8. Plating Aspect Ratio up to 20:1
Available Materials
  1. Epoxy FR-4
  2. Polyimide
  3. Cyanate Ester
  4. BT Resin
  5. Glass Ceramic
  6. Teflon
Pattern Features
  1. Min. Line Width: 0.004''
  2. Min. Spacing: 0.004''
  3. Min. SMD Component Lead Pitch: 0.010''
  4. Up to 7 Tracks on 0.100'' Grid
  5. BGA, TAB, COB, BIT Features
Surface Finish/Solder Resist
  1. Dry film or LPI Solder Resist
  2. Solder Resist over Fused SnPb
  3. SMOBC with HASL
  4. SMOBC with Organic Coating
  5. Selective Au/Ni Plating
Electrical Characteristics
  1. Impedance Control
  2. IR Drop
  3. Buried Resistors
Standard Panel Sizes
  1. 10.0 X 20.0		13.0 X 20.0
  2. 13.0 X 16.0		16.0 X 20.0
  3. 13.0 X 20.0		20.0 X 20.0
  4. 16.0 X 20.0		20.0 X 24.0
  5. 20.0 X 20.0		21.7 X 28.0
  6. 20.0 X 24.0		28.0 X 30.0


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