Multi-Chip Packages

WIRELESS MODULE in a single multichip package (MCP)
Utilizing "double side mount technology", Fujitsu is able to package 160 mixed technology components in a stan-dard PQFP configuration. Major components include: MPU, AIU, DSP, Modem, Memory, ASTRO (RF - ICs), and SAW Filters.


In today's competitive markets, the need to minimize "time-to-market" is essential. Since Multichip Package (MCP) has a standard form factor, no changes are required to existing assembly infrastructure. Utilizing readily available components will reduce unnecessary development time and cost, and minimize risks.

Fujitsu began manufacturing standard MCPs in high volume during the early 1980's and pioneered the double side mount process in 1985. To date, Fujitsu has manufactured over 3,500 different designs.

Fujitsu's MCP can accommodate two-dice design or more complex mixed technology sub-systems. The advanced chip mounting techniques ensure the highest densities in the smallest package.

Typical applications include: mobile computers, PDAs, wireless, cellular phones, LAN/modems and automotive.

MCP FEATURES


Multichip Package Line-up


Plastic Quad Flat Package (PQFP)
  • Pin Counts: Several Standard Configurations
  • Body Size: 24mm, 28mm, 40mm
  • Substrate: Laminate, Ceramic
  • Chip Mounting: W/B and Flip Chip
  • Supports Analog/Digital and Mixed Technologies
  • Dual Side Chip Attach


  • Printed Circuit Leadless Package (PCLP)
  • Pin Counts: Several Standard Configurations
  • Body Size: 11mm, 16mm, 20mm
  • Substrate: Laminate
  • Chip Mounting: W/B and Flip Chip
  • Direct and/or Standard Socket PWB Mounting
  • Ideal for Low Profile Applications (mount height = 2mm)


  • Ball Grid Array (BGA)
    type (A) "Epoxy Back Filled Version"
    type (B) "Overmolded Resin Version"
  • Pin Counts: Several Standard Configurations
  • Body Size: 27mm, 35mm, 40mm
  • Substrate: Laminate, Ceramic
  • Chip Mounting: W/B and Flip Chip
  • Custom Body Sizes and Pin Counts are Available


  • Land Grid Array (LGA)
    type (A) "Epoxy Back Filled Version"
    type (B) "Overmolded Resin Version"
  • Body Size: 27mm, 35mm, 40mm
  • Substrate: Laminate, Ceramic
  • Chip Mounting: W/B and Flip Chip
  • Custom Body Sizes and Pin Counts are Available


  • Fujitsu is a world leader in multichip packaging. We provide "total solutions" from initial design to high volume production for many leading companies. As the demand for more complex solutions increases, Fujitsu will be there with technology innovation.

    Fujitsu's Interconnect Technology home page can be accessed at http://www.fmi.fujitsu.com/products/intertech/intertech.html For more information about Fujitsu's extensive range of Interconnect Technology, please contact your local representative.


    Fujitsu World Offices

    Japan

    FUJITSU LIMITED
    Electronics Devices International
    Sales and Engineering Support Division
    1015 Kamikodanaka
    Nakahara-ku
    Kawasaki 211 Japan
    Tel: 044-754-3753

    North and South America

    FUJITSU MICROELECTRONICS, INC.
    Logic Products Division
    3545 North First Street
    San Jose, CA 95134-1804 USA
    Tel: 408-922-9000
    FAX: 408-432-9044/9045

    Europe

    FUJITSU MIKROELEKTRONIK GMBH
    Am Siebenstein 6-10
    63303 Dreieich-Buchschlag
    Germany
    Tel: (06103) 690-0
    FAX: (06103) 690-122

    Asia

    FUJITSU MICROELECTRONICS
    ASIA PTE LIMITED
    51 Bras Basah Road
    Plaza By The Park
    #06-04/07 Singapore 0719
    Tel: 336-1600
    FAX: 336-1609


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