Fujitsu Multichip Modules

Low-Power MCMs

Description
Fujitsu's Low-Power Multichip Module (MCM) is the most cost effective advanced packaging solution to solve the speed and density barriers imposed by traditional pack-aging and interconnection approaches.

Our MCM family is built on a multilayer ce-ramic substrate with a semiconductor die mounted on both sides and housed in a surface mountable plastic quad flat package.

Some of the features and their benefits are listed below.

STRUCTURE

Substrate Types

  • Thick film ceramic (allows resistor trimming)

  • Co-fired ceramic (best electrical characteristics)

    Electrical and Mechanical Properties Comparison

  • COMPONENTS

  • Almost any type of component can all be mounted on the Fujitsu Low-Power MCMs as long as maximum height requirements are not exceeded.

  • Fujitsu ICs are preferred.

    Capacitors

    Capacitors use laminated ceramic chips.

  • FILM CHARACTERISTICS
    Resistor Characteristics

    *Contact Fujitsu about resistors with a temperature coefficient of +100 ppm/°ree;C or a resistance tolerance of +1%.

    TEST FLOW

    NOTES ON USE
    Mounting
    If the MCM is left as is for a long time, absorbed moisture may lower package reliability when reflowing is performed. In this case, dehumidify the chip before mounting.

    The following graph shows a typical reflow profile.

    Cleaning
    Use alcohol to clean the package. Check thoroughly before using any other solvent.

    Do not attempt to clean the package ultrasonically or components in the package may be damaged. If ultrasonic clean-ing is unavoidable, check the package carefully before cleaning to ascertain its condition.

    Note: Use the metric measurements for PCB layouts. Inch measurements are only approximations [ ] refers to the 256 pin package only.

    Development Flowchart

    RELIABILITY CRITERIA

    THERMAL CHARACTERISTICS
    The IC's maximum power consumption varies with the circuit configuration, mounted components, and package. The following graph illustrates typical P T - T A characteristics.

    For further information please contact:

    Japan

    FUJITSU LIMITED
    Electronics Devices International
    Sales and Engineering Support Division
    1015 Kamikodanaka
    Nakahara-ku
    Kawasaki 211 Japan
    Tel: 044-754-3753

    North and South America

    FUJITSU MICROELECTRONICS, INC.
    Logic Products Division
    3545 North First Street
    San Jose, CA 95134-1804 USA
    Tel: 408-922-9000
    FAX: 408-432-9044/9045

    Europe

    FUJITSU MIKROELEKTRONIK GMBH
    Am Siebenstein 6-10
    63303 Dreieich-Buchschlag
    Germany
    Tel: (06103) 690-0
    FAX: (06103) 690-122

    Asia

    FUJITSU MICROELECTRONICS
    ASIA PTE LIMITED
    51 Bras Basah Road
    Plaza By The Park
    #06-04/07 Singapore 0719
    Tel: 336-1600
    FAX: 336-1609


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