Interconnect Technologies


FMI is one of the few semiconductor companies to offer value-added packaging solutions. FMI's interconnect expertise enables customers to combine products in unique ways to produce new levels of integration and performance. By making a substantial investment in this technology, Fujitsu helps designers reduce size, while improving performance.

The product offering includes custom modules such as hybrid ICs and multichip modules (MCMs). Fujitsu, which offers a wide range of MCM technology, recently announced a new MCM technology for high-performance CMOS parallel computers. The new technology features the highest pattern density in the world on an MCM substrate.

FMI also markets board-level products, such as printed wiring assemblies and printed wiring boards. In 1995, Convex Computer Corporation gave FMI a special award for its PWBs and PWAs. Convex uses the products in its Exemplar SPP1000 and SPP1200 systems.


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