M/L ConstructionsAvailable Materials
- Buried & Blind Vias
- Sequential Lamination
- 1/4 oz. to 14 oz. Cu
- 0.005'' Buried/Blind Vias
- 0.008'' Through Board Vias
- Max. 42 Layers / 0.300'' Thickness
- Min. 4 Layers / 0.016'' Thickness
- Plating Aspect Ratio up to 20:1
Pattern Features
- Epoxy FR-4
- Polyimide
- Cyanate Ester
- BT Resin
- Glass Ceramic
- Teflon
Surface Finish/Solder Resist
- Min. Line Width: 0.004''
- Min. Spacing: 0.004''
- Min. SMD Component Lead Pitch: 0.010''
- Up to 7 Tracks on 0.100'' Grid
- BGA, TAB, COB, BIT Features
Electrical Characteristics
- Dry film or LPI Solder Resist
- Solder Resist over Fused SnPb
- SMOBC with HASL
- SMOBC with Organic Coating
- Selective Au/Ni Plating
Standard Panel Sizes
- Impedance Control
- IR Drop
- Buried Resistors
10.0 X 20.0 13.0 X 20.0 13.0 X 16.0 16.0 X 20.0 13.0 X 20.0 20.0 X 20.0 16.0 X 20.0 20.0 X 24.0 20.0 X 20.0 21.7 X 28.0 20.0 X 24.0 28.0 X 30.0