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Description
Fujitsu's Low-Power Multichip Module (MCM) is the most cost effective advanced packaging solution to solve the speed and density barriers imposed by traditional pack-aging and interconnection approaches.Our MCM family is built on a multilayer ce-ramic substrate with a semiconductor die mounted on both sides and housed in a surface mountable plastic quad flat package.
Some of the features and their benefits are listed below.
STRUCTURE
Substrate Types
Thick film ceramic (allows resistor trimming)
Co-fired ceramic (best electrical characteristics) Electrical and Mechanical Properties Comparison
COMPONENTS
Almost any type of component can all be mounted on the Fujitsu Low-Power MCMs as long as maximum height requirements are not exceeded.
Fujitsu ICs are preferred. Capacitors
Capacitors use laminated ceramic chips.
FILM CHARACTERISTICS
Resistor Characteristics
*Contact Fujitsu about resistors with a temperature coefficient of +100 ppm/°ree;C or a resistance tolerance of +1%.
TEST FLOW
NOTES ON USE
Mounting
If the MCM is left as is for a long time, absorbed moisture may lower package reliability when reflowing is performed. In this case, dehumidify the chip before mounting.The following graph shows a typical reflow profile.
Cleaning
Use alcohol to clean the package. Check thoroughly before using any other solvent.Do not attempt to clean the package ultrasonically or components in the package may be damaged. If ultrasonic clean-ing is unavoidable, check the package carefully before cleaning to ascertain its condition.
Note: Use the metric measurements for PCB layouts. Inch measurements are only approximations [ ] refers to the 256 pin package only.
Development Flowchart
RELIABILITY CRITERIA
THERMAL CHARACTERISTICS
The IC's maximum power consumption varies with the circuit configuration, mounted components, and package. The following graph illustrates typical P T - T A characteristics.
For further information please contact:
Japan
FUJITSU LIMITED
Electronics Devices International
Sales and Engineering Support Division
1015 Kamikodanaka
Nakahara-ku
Kawasaki 211 Japan
Tel: 044-754-3753North and South America
FUJITSU MICROELECTRONICS, INC.
Logic Products Division
3545 North First Street
San Jose, CA 95134-1804 USA
Tel: 408-922-9000
FAX: 408-432-9044/9045Europe
FUJITSU MIKROELEKTRONIK GMBH
Am Siebenstein 6-10
63303 Dreieich-Buchschlag
Germany
Tel: (06103) 690-0
FAX: (06103) 690-122Asia
FUJITSU MICROELECTRONICS
ASIA PTE LIMITED
51 Bras Basah Road
Plaza By The Park
#06-04/07 Singapore 0719
Tel: 336-1600
FAX: 336-1609