- Surface Mount PWBs
- PWBs designed for high density mounting of flat package ICs, LSIs and chip components on a single side or on both sides, for more compact, higher performance electronic systems.
- Surface Blind Via Hole PWBs
- Blind vias connect the surface layer and inner layers without through holes to reduce the number of PWB layers. Higher density circuit designs can be achieved using a combination of blind via hole and surface mount technologies.
- Low Dielectric Material PWBs
- PWBs featuring glass-PTFE as low dielectric material offers signal propagation speeds up to 1.5 times faster than standard epoxy-glass based PWBs. These boards are used for LSI test equipment or supercomputer applications.
- High Layer Count Multilayer PWBs
- High layer count PWBs are used for supercomputer and large-scale mainframe computer systems. Fujitsu's M-780 series mainframe CPU uses this 42-layer PWB.
- Thin Multilayer PWBs
- Thin multilayer PWBs meet the light weight and small size requirements form many new systems demand. Fujitsu can supply PWBs as thin as 0.4mm (0.016 inch).