WIRELESS MODULE in a single multichip package (MCP)
Utilizing "double side mount technology", Fujitsu is able to package 160 mixed technology components in a stan-dard PQFP configuration. Major components include: MPU, AIU, DSP, Modem, Memory, ASTRO (RF - ICs), and SAW Filters.
In today's competitive markets, the need to minimize "time-to-market" is essential. Since Multichip Package (MCP) has a standard form factor, no changes are required to existing assembly infrastructure. Utilizing readily available components will reduce unnecessary development time and cost, and minimize risks.Fujitsu began manufacturing standard MCPs in high volume during the early 1980's and pioneered the double side mount process in 1985. To date, Fujitsu has manufactured over 3,500 different designs.
Fujitsu's MCP can accommodate two-dice design or more complex mixed technology sub-systems. The advanced chip mounting techniques ensure the highest densities in the smallest package.
Typical applications include: mobile computers, PDAs, wireless, cellular phones, LAN/modems and automotive.
MCP FEATURES
- Standard PQFP, PCLP, BGA and LGA packages
- Extensive component mounting including "double side mount"
- Increased electrical and thermal performance
- Controlled impedance
- No changes in existing assembly infrastructure
Multichip Package Line-up
Plastic Quad Flat Package (PQFP)Pin Counts: Several Standard Configurations
Body Size: 24mm, 28mm, 40mm
Substrate: Laminate, Ceramic
Chip Mounting: W/B and Flip Chip
Supports Analog/Digital and Mixed Technologies
Dual Side Chip Attach
Printed Circuit Leadless Package (PCLP)Pin Counts: Several Standard Configurations
Body Size: 11mm, 16mm, 20mm
Substrate: Laminate
Chip Mounting: W/B and Flip Chip
Direct and/or Standard Socket PWB Mounting
Ideal for Low Profile Applications (mount height = 2mm)
Ball Grid Array (BGA)
type (A) "Epoxy Back Filled Version"
type (B) "Overmolded Resin Version"Pin Counts: Several Standard Configurations
Body Size: 27mm, 35mm, 40mm
Substrate: Laminate, Ceramic
Chip Mounting: W/B and Flip Chip
Custom Body Sizes and Pin Counts are Available
Land Grid Array (LGA)
type (A) "Epoxy Back Filled Version"
type (B) "Overmolded Resin Version"Body Size: 27mm, 35mm, 40mm
Substrate: Laminate, Ceramic
Chip Mounting: W/B and Flip Chip
Custom Body Sizes and Pin Counts are Available
Fujitsu is a world leader in multichip packaging. We provide "total solutions" from initial design to high volume production for many leading companies. As the demand for more complex solutions increases, Fujitsu will be there with technology innovation.Fujitsu's Interconnect Technology home page can be accessed at http://www.fmi.fujitsu.com/products/intertech/intertech.html For more information about Fujitsu's extensive range of Interconnect Technology, please contact your local representative.
Fujitsu World Offices
JapanFUJITSU LIMITED
Electronics Devices International
Sales and Engineering Support Division
1015 Kamikodanaka
Nakahara-ku
Kawasaki 211 Japan
Tel: 044-754-3753North and South America
FUJITSU MICROELECTRONICS, INC.
Logic Products Division
3545 North First Street
San Jose, CA 95134-1804 USA
Tel: 408-922-9000
FAX: 408-432-9044/9045Europe
FUJITSU MIKROELEKTRONIK GMBH
Am Siebenstein 6-10
63303 Dreieich-Buchschlag
Germany
Tel: (06103) 690-0
FAX: (06103) 690-122Asia
FUJITSU MICROELECTRONICS
ASIA PTE LIMITED
51 Bras Basah Road
Plaza By The Park
#06-04/07 Singapore 0719
Tel: 336-1600
FAX: 336-1609